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Heat Shrink Compound Solution PVN Inc. Special Bonding Agent

Rs.5,000.00

Inclusive GST

4100.00

Exclusive GST

  • Heat Sink Compound (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste, or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of thermal interface material.
  • As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between a heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to applying pressure, spreading the Heat Sink Compound.

 

Description

Features

  • The non-adhesive side exhibits excellent features of polytetrafluoroethylene (PTFE) such as electrical properties, resistance to heat, weather, chemical, and water (water shedding), and non-adhesiveness.
  • Superior tensile strength.
  • Superior flame resistance.
  • Can be used in a wide range of temperature (-60°C – 200°C), however, it may vary according to the use condition.

Applications

  • For roll wrapping in polyethylene laminators (Suitable for long continuous use as the tape has superior durability and mechanical strength).
  • For endless belts of polyethylene laminators (Depending on application,Time for changing tapes upon dimensional change of laminated products can be shortened by making a double-layered endless belt, adhering with NITOFLON No.923UL or No.923S.)
  • For insulation of coils as a class H insulating material.
  • Can be laminated with metals, plastics and ceramics as general sliding materials.

 

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