PVN Anabond Heat Sink Compound Paste 652C / Thermally Conductive Heat-Sink Paste

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• CHEMSOL thermal conductive Compound/Paste/Gel:is designed to provide efficient thermal transfer for the cooling of PCB system assembly modules used in computer, power supply, and automotive applications, it has high thermal conductivity, low thermal resistance, no flow, very low oil bleed, no sedimentation, no volatility, and good wattability.Can be applied for cooling the interface of cooler heatsink and GPU VRM VRAM PCB LED, BJT MOSFET transistor, Voltage regulator, IC Chips, etc
• The deformability is very low, it can be compressed to the thinnest 0.1mm, there is almost no hardness, and there is no internal stress on the equipment. It can fill any uneven gap and is safe and non-conductive. It is widely used in the fields of LED chips, communication equipment, mobile phone CPU, memory module IGBT and other tool modules, and power semiconductors. PCB system assemblies are continually designed to deliver higher performance. Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern of design engineers.